JPH0415993B2 - - Google Patents
Info
- Publication number
- JPH0415993B2 JPH0415993B2 JP58080401A JP8040183A JPH0415993B2 JP H0415993 B2 JPH0415993 B2 JP H0415993B2 JP 58080401 A JP58080401 A JP 58080401A JP 8040183 A JP8040183 A JP 8040183A JP H0415993 B2 JPH0415993 B2 JP H0415993B2
- Authority
- JP
- Japan
- Prior art keywords
- load
- terminal
- terminal board
- board
- switch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003780 insertion Methods 0.000 claims description 17
- 230000037431 insertion Effects 0.000 claims description 17
- 238000005476 soldering Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 10
- 239000003990 capacitor Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000002537 cosmetic Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58080401A JPS59205173A (ja) | 1983-05-09 | 1983-05-09 | 電子スイツチの端子構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58080401A JPS59205173A (ja) | 1983-05-09 | 1983-05-09 | 電子スイツチの端子構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59205173A JPS59205173A (ja) | 1984-11-20 |
| JPH0415993B2 true JPH0415993B2 (en]) | 1992-03-19 |
Family
ID=13717263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58080401A Granted JPS59205173A (ja) | 1983-05-09 | 1983-05-09 | 電子スイツチの端子構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59205173A (en]) |
-
1983
- 1983-05-09 JP JP58080401A patent/JPS59205173A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59205173A (ja) | 1984-11-20 |
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